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01 / FPGA and Digital Architecture

Zynq-7010 SoC PCB

A 10-layer impedance-controlled board integrating DDR3L, eMMC, QSPI flash, Gigabit Ethernet, and sequenced multi-rail power.

High-speed layout

The DDR3L interface uses fly-by topology, 0.8 mm-pitch BGA fanout, controlled impedance, and delay-matched routing.

The 10-layer stackup and return paths support 60 Ω single-ended routing with 50 Ω termination and 100 Ω differential pairs.

Signal-integrity validation

Manufacturer IBIS models are used in Altium Signal Integrity Analysis to evaluate reflections, overshoot, undershoot, and timing margin before fabrication.